MF/TSETS

Version 9. Using MF/TSETS the thermosets engineer can study flow behavior inside the mold, and optimize the effects of design and processing on product appearance and performance. MF/TSETS is tailored for Reaction Injection Molding (RIM), Transfer Molding, I.C. Chip Encapsulation, Bulk Molding Compound (BMC) injection molding, and Resin Transfer Molding (RTM).

When used to optimize the competitive IC Chip encapsulation process, MF/TSETS enables the user to predict and avoid wire sweep, voids, and weld line placement during the design phase, when cost of change is minimal. Automatic runner balancing maintains uniform polymer flow to each cavity, minimizing wire sweep and material wastage.

Hugh Henderson

CEO
Moldflow Pty Ltd.
259-261 Colchester Road
Kilsyth, VICT3137 3137
Australia
011-61-3-720-2088
011-61-3-729-0433 (fax)

For applications in related solution areas, see the following indices: