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Text File  |  1987-06-02  |  8KB  |  191 lines
  1.  
  2.  
  3.  
  4.                               TELEDYNE MICROELECTRONICS
  5.  
  6.          Leader in the Science of Microelectronics Packaging and Production
  7.  
  8.        Want  to  determine  how our products, services  and  capabilities  can
  9.        support your design and production requirements? It's easy. There's  no
  10.        need  for complex inquiry forms. Simply provide us with what  you  have
  11.        already  prepared: circuit schematics, weight and  volume  requirements
  12.        and,   if  you  have  them,  a  component  list,  screening  and   test
  13.        specifications.  We'll evaluate your requirements and  provide  pricing
  14.        and  delivery  information.  Your inquiry will  be  handled  in  strict
  15.        confidence. Our sensitivity to security, nondisclosure policies and our
  16.        ability to protect proprietary data is another feature of our services.
  17.        Whether  your  application is a new system, or you wish to  improve  an
  18.        existing  product, contact us as early as possible in your  development
  19.        schedule... the sooner, the better.
  20.  
  21.                                CUSTOM MICROELECTRONICS
  22.  
  23.      o Memory Hybrids     o Microprocessor Hybrids      o Chip Carrier Assy.
  24.      o Medical Hybrids    o Signal Conversion Hybrids   o Modular Assemblies
  25.      o Display Modules    o Gate Array Hybrids          o High Power Hybrids
  26.      o Substrates         o Fiber-Optic Hybrids         o Severe Environments
  27.      o Subsystems         o Analog/Digital Hybrids      o High Frequency (MIC)
  28.  
  29.  
  30.  
  31.                        CUSTOM MICROCIRCUIT SUBSTRATE CAPABILITIES
  32.  
  33.       PARAMETERS                     THICK FILM     THIN FILM       CO-FIRED
  34.  
  35.       o Lines & Spaces (Minimum)     0.010"         0.001"          0.010"
  36.           Special                    0.005"
  37.  
  38.       o Multilayer                   8-10 Layers    In Development  Yes
  39.  
  40.       o Resistors                                                   N/A
  41.           Value Range                1-10 Megohms   1-200 K Ohms
  42.           Tolerance                  +/-0.5%        +/-0.01%
  43.           Stability                  2%             0.1%
  44.           Tracking Stability         25 ppm         2 ppm
  45.           Temperature Coefficient    +/-100ppm/DegC +/-0 to 25ppm/DegC
  46.           Temp Coefficient Tracking  200ppm/DegC    10ppm/DegC
  47.           High Frequency             Thru 10 GHz    Thru 26 GHz
  48.  
  49.       o Usages
  50.           Specialty Chips            Yes            Yes             N/A
  51.           Ladder Networks            Yes            Yes             N/A
  52.           Resistor Arrays            Yes            Yes             N/A
  53.           Daughter Boards            Yes            Yes             N/A
  54.           Hybrid Microcircuits       Yes            Yes             Yes
  55.           Custom Electronic Modules  Yes            Yes             Yes
  56.           SEM Modules (MIL-M-28787)  Yes            Yes             Yes
  57.  
  58.       o Technologies                 Noble &        Deposition:     Low or
  59.                                      Non-Noble      Sputtering      High
  60.                                      Alloys         or Vacuum       Temperature
  61.  
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  64.                                         Page 1
  65.  
  66.  
  67.  
  68.                             CUSTOM PACKAGING CAPABILITIES
  69.  
  70.       Analog      Bipolar  and  FET  transistor  circuits,  linear IC's, ASIC's,
  71.                   power supply  PWM controllers,  Signal Conversion,  monitoring
  72.                   and supervisory circuits, resistor ladder network arrays, etc.
  73.  
  74.       Power       Black-box-design   or  build-to-specification  switching   and
  75.       Supply      linear power supplies, linear regulators, PWM Switch  drivers,
  76.                   power converters, etc.
  77.  
  78.       High-Power  Power   bridges  (FET  or  bipolar):  Single  or   multiphase,
  79.                   rectifier   diode   power   packs,   inverters,    regulators,
  80.                   intensifiers,    converters,   servoactuators,    controllers,
  81.                   sensors,   pulse  or  positioning  regulators  and   switches,
  82.                   drivers, exciters, relays, etc.
  83.  
  84.                   Performance:
  85.                     Power dissipation densities of 200 W/sq in
  86.                     Thermal impedance of 0.5 Degrees C/W
  87.                     Currents to 75 amps
  88.                     400 W Maximum average power, 4 KW peak
  89.  
  90.       Digital     TTL, CMOS, ECL, PAL's, PLD's, semicustom and custom multi-chip
  91.                   build-to-specification or black-box-design hybrids.
  92.  
  93.       Memory      Large static or dynamic RAM's, ROM's, EEPROM's, UVEPROM's, 
  94.       Arrays      etc.
  95.  
  96.       Analog/     A to D, D to A converters, digital signal processing circuits,
  97.       Digital     etc.
  98.  
  99.       High        50  MHz  through  26  GHz RF, Microwave  and  SAW  hybrids  in
  100.       Frequency   standard,  multicavity  or connectorless  grounded  microstrip
  101.                   (CGM tm) configurations.
  102.  
  103.                   Log amps, mixers, up converters, down converters, attenuators,
  104.                   filters, transmitters, receivers, synthesizers, switches, etc.
  105.  
  106.                   Radar/Sonar  output  stages,  RF/microwave  transmitters   and
  107.                   receivers, signal processors and amplifiers.
  108.  
  109.       Signal      Coders, decoders and combinations.
  110.       Coding
  111.  
  112.       Medical     Ultra-low  power  hybrids  for  implantable   life-sustaining,
  113.                   therapeutic and diagnostic applications.
  114.  
  115.       Displays    Dot matrix and alphanumeric, monochrome,  multi-color or  full
  116.                   color.
  117.  
  118.                   LED, LCD, EL and plasma technologies.
  119.  
  120.                   Flat  panel information instrumentation, CRT  replacement  and
  121.                   helmet  mounted applications with integral  modularized  drive
  122.                   and control circuitry and optical filters.
  123.  
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  127.                                         Page 2
  128.  
  129.  
  130.  
  131.       Optical     Fiber-optic links:  transmitter-modulator/receiver-demodulator
  132.                   pairs.
  133.  
  134.                   Focal plane diode arrays, integral address, control and  drive
  135.                   circuitry.
  136.  
  137.                   Laser data transmitters and receivers.
  138.  
  139.                   Data   annotation   and  readout  devices   for   photographic
  140.                   applications,  target  designators, range  finders  and  night
  141.                   vision goggle applications.
  142.  
  143.       Severe      Specialized   hermetic  MIL-SPEC  Class  "B"  or   Class   "S"
  144.       Environment packaging:
  145.  
  146.                     High-Temperature (250 Degrees C)
  147.                     High-Shock (50,000 Gs)
  148.                     High-Pressure (3,500 psi)
  149.                     High-Radiation (10 MegRADs Si)
  150.  
  151.       Radiation/  Black-box-design or build-to-print hardness critical packaging
  152.       Tempest/    for all levels of integration.
  153.       EMP
  154.       Hardened
  155.       Packaging
  156.  
  157.       Modular     For analog, digital, high-frequency, medical, power  supplies,
  158.       Assemblies  information display, optical-electronic and severe environment
  159.       and         hardened applications.
  160.       Subsystems
  161.                   Standard electronic module formats (MIL-M-28787)
  162.  
  163.                   Custom  PCB, MATRIX, and chip carrier SMT packaging  including
  164.                   rigid-flex assemblies.
  165.  
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  167.  
  168.  
  169.  
  170.  
  171.                               TELEDYNE MICROELECTRONICS
  172.  
  173.                                  12964 Panama Street
  174.                             Los Angeles, California  90066
  175.  
  176.                           (213)822-8229   -   (213)870-9831
  177.  
  178.  
  179.  
  180.  
  181.  
  182.               "Leader in the Science of Hybrid Packaging and Production"
  183.  
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  190.                                         Page 3
  191.